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Strong-Adhesion Opaque Black FPC Coverlay – High-Temp Stable & High-Grade Insulation for Flexible Circuits

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Strong-Adhesion Opaque Black FPC Coverlay – High-Temp Stable & High-Grade Insulation for Flexible Circuits

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Brand Name : Guofeng

Model Number : 7.5um

Certification : UL ISO ROHS

Place of Origin : China

MOQ : Negotiation

Price : $300-$30000

Payment Terms : L/C,T/T

Supply Ability : Negotiation

Delivery Time : Negotiation

Packaging Details : Standard Packing

Chemical Resistance : Excellent

Adhesive Strength : High

Electrical Insulation : High

Flexibility : Flexible

Mechanical Strength : Strong

Material : Polyimide

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Strong-Adhesion Opaque Black FPC Coverlay – High-Temp Stable & High-Grade Insulation for Flexible Circuits
High-performance black polyimide film specifically designed for flexible printed circuit applications with superior light-shielding properties.
Place of Origin ANHUI, CHINA
Certification UL ISO ROHS
Material Polyimide
Color Yellow
Treatment Single-side / Both Sides
Width 514MM 520MM 1028MM 1040MM
Thickness 12.5μm 18μm 20μm 25μm
Packing Style Standard Packing
Roll Length Customized
Packaging Details Wooden pallet
Supply Ability 2000 ton/year
Product Overview
The GL Series of high-performance polyimide films are biaxially oriented, natural (yellow) films independently developed and manufactured by our company. Available in three variants with distinct thicknesses and performance profiles, they are primarily employed as adhesive substrates, for chip encapsulation, and in related application areas.

Product Features

  • Outstanding mechanical robustness demonstrated across comprehensive stress tests

  • Ultra-low coefficient of thermal expansion (CTE) for consistent dimensional stability under severe temperature variations

  • Excellent surface adhesion properties ensuring dependable bonding with a wide range of substrate materials

  • Compliant with RoHS and REACH regulations and certified to UL safety standards

Product Applications
The GL Series High-Performance Polyimide Film is a critical material in several advanced applications, including high-precision adhesive-based FCCL substrates, highly stable coverlay films, semiconductor chip encapsulation, and specialized adhesive tape substrates.

Why Choose Our Factory?

  • Direct Factory Pricing: By eliminating middlemen, we provide competitive costs, flexible minimum order quantities, and faster delivery schedules.

  • Expert Technical Support: We offer tailored anti-fog testing protocols based on your needs and professional assistance to improve packaging performance indicators.

  • Customizable Specifications: Available in custom thicknesses, widths, and surface finishes (matte, glossy, metallic), our polyimide film ensures consistent quality, short lead times, and attractive pricing for volume orders.

Product Images
Strong-Adhesion Opaque Black FPC Coverlay – High-Temp Stable & High-Grade Insulation for Flexible Circuits Strong-Adhesion Opaque Black FPC Coverlay – High-Temp Stable & High-Grade Insulation for Flexible Circuits
Handling & Storage Instructions
To preserve long-term durability and optimal performance of our Polyimide Film, please comply with the following storage guidelines:
Shelf Life: Valid for 6 months from the date of production.
Storage Requirements:
  • Store in a cool, dry environment protected from direct sunlight
  • Avoid contact with high-humidity conditions or drastic temperature fluctuations
Related Products
Polyimide film

Product Tags:

black FPC coverlay insulation

      

high-temp stable FPC coverlay

      

opaque flexible circuit coverlay

      
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